The global EMI shielding market is growing rapidly, with an expected value of $9.4 billion by 2028. As businesses face increasing challenges in protecting electronics from electromagnetic interference (EMI), innovative solutions are crucial to staying competitive.
Enter 3D printing. Specifically, Fused Deposition Modeling (FDM), which offers a quick and effective way to produce superior EMI/RF shielding solutions. FDM materials, such as copper, tungsten, or barium titanate-filled polymers, provide lightweight and customizable options for diverse applications. These materials eliminate the need for complex machining or vapor deposition processes, making them ideal for meeting the criteria of various EMI/RF factors and physical implementations.
OpenAM software takes the capabilities of Stratasys Fortus 450mc and F900 printers to the next level by allowing users to explore custom-filled, non-Stratasys materials and access additional printing parameters. This powerful tool enables expert FDM engineers to translate research findings into practical, repeatable, and reliable applications.
By harnessing the power of OpenAM, users can intentionally control mechanical properties, surface finish, and shielding levels when working with high-requirement materials. Compared to traditional manufacturing methods, testing cycles with OpenAM on a Stratasys Fortus printer are shorter and more cost-effective, enabling solutions for nearly any fit or form factor.
Adhering to defense and military standards is also easier with OpenAM, as users can enhance desired properties down to specific sections of a geometry, ensuring repeatable and reliable results that can be seamlessly transferred to production.
Contact your Stratasys reseller today or download our application brief "Advancing Your Competitive Advantage with OpenAM: Next-Generation 3D Printed EMI/RF Shielding" to learn more.
